期刊论文

Effects of Compound Reducing Agents SHP and HAS on Electroless Gold Plating on Ni-P Surface

中文

表面技术

1001-3660

2019

48

10

301-308

10.16490/j.cnki.issn.1001-3660.2019.10.037

国家工业信息化部、财经部绿色制造系统集成项目 长沙市科技计划项目(Kq1706063)。

本校为第一机构

目的 研究复合还原剂次亚磷酸钠(SHP)和硫酸羟胺(HAS)对置换镀金过程的影响,拟解决化学镀Ni-P层上置换镀金的镍腐蚀和后期沉金困难的问题.方法 采用连续加热测试,研究了还原剂对镀液稳定性的影响.利用密度泛函理论对配合物分子进行了计算,对比了反应前后配合物分子结构的福井函数和轨道能级.通过XRF测试了金层的厚度,并结合开路电位分析了还原剂对镀层厚度的影响.利用恒电位下电流瞬变对金核生成和成长的影响进行了分析.通过SEM对镀层的微观形貌进行了表征;通过Tafel测试对镀层的电化学抗腐蚀性进行了分析.结果 次亚磷酸钠和硫酸羟胺同时加入不会影响镀液的稳定性,羟胺与腈根的反应降低了Au+的反...

The work aims to study the effect of the reducing agents like sodium hypophosphite (SHP) and hydroxyl sulfate (HAS) on immersion gold-plating, so as to solve the problems of corrosion and difficult deposition in late period of immersion gold-plating on Ni-P layer. The effects of reducing agents on stability of plating bath were studied by continuous heating test. The molecules of compounds were calculated by density functional theory, and the Fukui function and orbital energy level were compared before and after the reaction. Au thickness was t...