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Electroless copper plating mechanism of mesophase pitch-based carbon fibers by the grafting modification of silane couple agents

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成果类型:
期刊论文
作者:
Zou, Jialing;Shi, Jiangfan;Yang, Jianxiao;Li, Jun;Liu, Yue
通讯作者:
Jianxiao Yang
作者机构:
[Liu, Yue; Yang, Jianxiao; Shi, Jiangfan; Zou, Jialing] Hunan Univ, Coll Mat Sci & Engn, Hunan Prov Key Lab Adv Carbon Mat & Appl Technol, Changsha 410082, Peoples R China.
[Li, Jun] Changsha Univ Sci & Technol, Sch Chem & Biol Engn, Changsha 410114, Peoples R China.
通讯机构:
[Jianxiao Yang] H
Hunan Province Key Laboratory for Advanced Carbon Materials and Applied Technology, College of Materials Science and Engineering, Hunan University, Changsha 410082, China
语种:
英文
关键词:
Electroless copper plating;Interfacial structures;Mesophase-pitch based carbon fibers;Silane coupling agents;Surface modification
期刊:
Materials Today Communications
ISSN:
2352-4928
年:
2022
卷:
32
页码:
104053
基金类别:
National Natural Science Foundation for Young Scientists of China [51702094]; Natural Science Foundation of Hunan Province, China [2020JJ4203, 2019JJ50651]
机构署名:
本校为其他机构
院系归属:
化学与生物工程学院
摘要:
Electroless copper plating mechanism of mesophase pitch-based carbon fibers (CFs) by the novel silane couple agents (SCAs) sensitization method was investigated based on the three different functional groups of SCAs (KH550, KH570, KH792). The results showed that relatively stable oligomer films could be formed on the surface of CFs after the sensitization treatment with three kinds of SCAs, which promoted adhesion of CFs with copper plating. Besides, a larger crystalline size, lower resistivity, more uniform and continuous coated copper layers were observed in the copper-plated CFs with KH550 ...

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